Metallized Films
Metallized films are produces by depositing thin pure metal layer on the substrates in order to enhance barrier properties and the visual aesthetics of the substrates. Metallization improves moisture barrier, aroma barrier, gas barrier and light barrier properties of the substrates.
Applications
Metallized films are widely used in packaging applications of food and non food items where enhance barrier properties are required. Some of the applications are as follows:
- Food and Beverage Packaging
- Biscuits and Confectionary Packaging
- Personal care Product Packaging
- Medical Packaging
- Temper proof Packaging
- Industrial Packaging
The Product - Metallized Films
Different grades of following metallized substrates are available:
- Metallized BOPP
- Metallized BOPET
- Metallized CPP
- Metallized Nylon
- Metallized Paper
BOPP Metallized Heat Sealable
Code: BMD
Available Thickness μ: 15 to 50
Salient Features: Uniform optical density, low heat seal temperature, excellent heatseal integrity, good lamination quality with metallized surface. Excellent moisture barrier and improved gas barrier.
Applications: Metallized for lamination with printed or un-printed paper, film, foil and board. Used as a heat sealable substrate in laminates for packaging of Bakery products, Biscuits, confectionary, ice-cram, vegetables, snack foods, chips, dried foods and miscellaneous food and non food items requiring increased moisture, aroma and gas barrier properties.
BOPET Metallized
Code: PMD
Available Thickness μ: 8 to 36
Salient Features: Uniform optical density, low heat seal temperature, excellent machinability and good lamination quality with metallized surface. Excellent gas barrier and improved moisture barrier.
Applications: Metallized for lamination with printed or un-printed paper, film, foil and board. Used as a heat sealable substrate in laminates for packaging of Bakery products, Biscuits, confectionary, ice-cram, vegetables, snack foods, chips, dried foods and miscellaneous food and non food items requiring increased moisture, aroma and gas barrier properties.
CPP Metallized Heat Sealable
Code: CMD
Available Thickness μ: 20 to 25
Salient Features: Uniform optical density, low heat seal temperature, excellent heatseal integrity, good lamination quality with metallized surface. Improved moisture and gas barrier.
Applications: Metallized for lamination with printed or un-printed paper, film, foil and board. Used as a heat sealable substrate in laminates for packaging of Bakery products, Biscuits, confectionary, ice-cram, vegetables, snack foods, chips, dried foods and miscellaneous food and non food items requiring increased moisture, aroma and gas barrier properties.
Nylon Metallized
Code: NMD
Available Thickness μ: 15 to 20
Salient Features: Uniform optical density, low heat seal temperature, , good lamination quality with metallized surface, excellent gas and aroma barrier
Applications: Metallized for lamination with printed or un-printed paper, film, foil and board. Used as a heat sealable substrate in laminates for packaging of Bakery products, Biscuits, confectionary, ice-cram, vegetables, snack foods, chips, dried foods and miscellaneous food and non food items requiring increased moisture, aroma and gas barrier properties.
Metallized Paper
Code: MDP
Available Thickness μ: 60 to 296 gsm
Salient Features: Uniform thickness across the width, Uniform Optical Density, Excellent lamination quality, Excellent machinability
Applications: Used as one of the substrate in laminates or single layer for packaging of Bakery products, Biscuits, confectionary, ice-cram, vegetables, snack foods, chips, dried foods and miscellaneous food and non food items requiring increased moisture and gas barrier properties.
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